The Primo AD-RIE® system is AMEC’s second-generation dielectric etch product. Built upon the proven D-RIE architecture, the system embodies new proprietary designs featuring advanced capabilities such as a switchable dual-low-frequency RF generator, multi-zone gas distribution, and dual-chiller temperature control system. To maximize productivity, the AD-RIE system employs a cluster tool design that can be configured with up to three dual-station process modules (or six processing stations) per system. The AD-RIE product delivers the most advanced capabilities for new generation IC device manufacturing requirements, world wildly used for 40-7nm BEOL applications, and 10nm FEOL applications development and production. Furthermore, AMEC developed Primo AD-RIE series products: Primo AD-RIE-e and Primo AD-RIE-cr. Primo AD-RIE-e is configured with step-by-step temperature control 4-zone dynamic ESC, which helps improve etch uniformity and selectivity with wider process window. The Primo AD-RIE-cr features corrosion resist chamber with AMEC’s proprietary surface coating technology, which offers solutions for dielectric, metal and metal oxide complicated structure etch.
Innovative solutions for semiconductor device fabrication at 40nm to 7nm nodes
Dual-station chamber design with more effective throughput
Switchable bias RF system for by-step recipe control
Pulsing RF system as option
Multi-zone gas distribution system
Dual zone ESC for temperature control
Dynamic ESC option for step-by-step temperature control (Primo AD-RIE-e)
Corrosion resist chamber with proprietary surface coating technology (Primo AD-RIE-cr)
Integrated strip capability and surface charge reduction capability (Primo iDEA® System)
In-situ high-and-low bias-frequency switch system, for wider process window (especially Trench/Via All-in-one applications)
Excellent process control, tunability and stability for advanced processing criteria
High throughput and low cost of ownership (CoO)
Series products for various typical applications: Primo A
