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Preforma Uniflex™ CW system, a 12 inch CVD metal-tungsten deposition equipment developed by AMEC independently, is high production-efficiency and excellent performance. lt can configure with up to five dual-station chambers (total 10 stations), each capable of processing two wafers simultaneously, ensuring lower production costs and chemical consumption while achieving higher production-efficiency. Preforma Uniflex™ is equipped with an optimized gas mixer with proprietary intellectual property rights, optimized shower head, pumping system and vacuum chuck with independent design. lt offers good film uniformity, good gap fill performance and process flexibility, as well as strong process handling capability for warped wafer. And its excellent step coverage and gap fill capabilities meet the requirements of W via/trench applications in advanced logic, DRAM and 3D NAND device.

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              Preforma Uniflex™ CW
              Cost-effective metal-tungsten filling solution for logic and memory chip
              Products Features
              Dual-station chamber and system can configured with up to five dual-station chambers
              Independent and small reaction space
              Effective and flexible process tuning window
              Optimized gas mixer with proprietary intellectual property rights
              Self-designed pump system with optimized gas distribution
              Self-designed heater with optimized vacuum chuck
              Competitive Advantages
              High efficiency, low cost and chemical consumption
              Excellent film uniformity and gap fill capability
              Excellent process adaptation and compatibility
              Good process handling capability for warped wafer